ULTILE Precision Wafer and Glass Cutting Tools

Product Description

The ULTILE Precision Glass and Wafer Cutter is a high precision lab-scale scriber that provides the best possible edge quality after cutting. It has an ergonomic design for ease-of-use and comes equipped with an adjustable pressure dial, which allows for consistent scribing with every pass, with no pressure needed from the user. The users can opt for either a carbide or diamond cutting wheel depending on their intended application and wafer specifications.

Typical materials that can be cut with the ULTILE Precision Glass and Wafer Cutter include:

• Glass and oxide coated glass wafers(such as ITO glass, FTO glass and AZO glass)
• Quartz (such as fused quartz, quartz wafers, plates, slides, and coverslips)
• Silicon wafers
•   Sapphire wafers and substrates
• Other crystal substrates and wafers

The samples can be cut into pieces as small as 3cm x 3cm, though the minimum size is determined by the sample’s thickness. Thinner samples, such as coverslips and silicon wafers can be cut to less than 5mm x 5mm in size with a little practice. This allows users to create their own custom size substrates to meet their specific device design requirements.

How to use:

1)       Adjust the height of the wheel based on the thickness of the material being cut.

2)       Set the proper pressure between 1 and 50 N

3)       Align substrate material along the integrated scale to achieve the desired size

4)       Use the optional magnetic holder to secure the material in place

5)       Pull back on the scribing handle to create the scribing mark

6)       Achieve a perfect cleave along the scribing mark either by hand or by using a pair of glass breaking pliers.

Cutting Wheels Options

Cutting wheels are NOT included with the cutting table, and they should be ordered separately. 

Four different Carbide cutting wheels are available to handle standard materials from 0.15 mm up to 3 mm in thickness. There are also four different Diamond cutting wheels available for use on harder materials (such as sapphire, YSZ, etc.) ranging from 0.15 mm to 3.0 mm in thickness.

Magnetic clamps are also available to securely hold substrates in place for cutting.
The ULTILE Precision Glass and Wafer Cutters are available in five sizes to accommodate a wide range of sample sizes: 100 mm (4 inch), 200 mm (8 inch), 300 mm (12 inch), 400 mm (16 inch), and 500 mm (20 inch).

Accessories Options:

Dedicated Magnifier and Holder for ULTILE Precision Wafer and Glass Cutting Tools

Assembly for the Cutting Handle.