Semiconductor Wafers & Substrates

MSE Supplies provides both standard and customized high quality Semiconductor Wafers and Substrates for a wide range of applications. Wafers are mainly serve as the base for the fabrication of numerous semiconductor devices. Through a series of processing steps, the electronic components like transistors, diodes, and integrated circuits can be created.

Key Parameters for Semiconductor Wafers:

a. Material: Silicon is the most common material used for semiconductor wafers. Other materials including Silicon Carbide (SiC), Gallium Nitride (GaN), Gallium Arsenide (GaAs), Glass, Germanium, Sapphire, etc.

b. Diameter: Wafers come in various diameters, with 200mm (8 inches) and 300mm (12 inches) being common sizes in modern semiconductor manufacturing. Larger diameters allow for more chips to be produced from a single wafer, increasing efficiency.

c. Orientation: Wafers are cut from an ingot in specific crystal orientations, usually the <100> or <111> orientation. The orientation affects the electronic properties of the resulting devices.

d. Dopants: Dopants are introduced into the semiconductor material to modify its electrical properties. Common dopants include boron (p-type) and phosphorus (n-type). Dopants are used to create the desired electrical behavior for different semiconductor devices.

e. Thickness: Wafers are sliced from a silicon ingot and have a specific thickness. Thinner wafers are generally more desirable as they reduce the distance that electrical signals must travel within the device, improving performance and reducing power consumption.

f. Carrier Concentration: Carrier concentration refers to the density of charge carriers (electrons or holes) within the semiconductor material. It affects the conductivity and performance of the device.

g. Bow and Warp: Wafer bow refers to the slight curvature of a wafer's surface, while warp refers to the overall shape of the wafer. Minimizing bow and warp is crucial for maintaining uniformity during processing.

h. Surface Finish & Roughness: The surface finish of a wafer is critical for process steps like lithography and etching. A smooth and clean surface is necessary for precise patterning and the formation of intricate structures. Most commonly surface finish types including etched, lapped, optical polished, CMP polished, etc. This parameter is often defined as Ra.

Popular Products MSE Offers

Al₂O₃ (Sapphire): standard/patterned
Diamond Wafer: single crystal/polycrystalline
Gallium Nitride(GaN): N-type/Semi-Insulating
Silicon (Si): Up to 12 inch in diameter, CZ/FZ, N-type/P-type/intrinsic
Silicon Carbide (SiC): 4H/6H/3C, N-type/Semi-Insulating/HPSI/P-type

In summary, semiconductor wafers are a specific type of substrate used for creating semiconductor devices. However, substrates encompass a broader range of materials and applications beyond just wafers, including the underlying materials used in various semiconductor manufacturing processes. Both wafers and substrates are fundamental to the fabrication of electronic components that power modern technology.

Click here for a composition list of our Crystals, Wafers and Substrates

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