AR-P 3100 Series Adhesion-enhanced Positive Resists for the Production of Masks and Fine Scale Divisions, 100mL/bottle
SKU: CM8106
AR-P 3100 Series Adhesion-enhanced Positive Resists for the Production of Masks and Fine Scale Divisions, 100mL/bottle
Photoresists are in particular used in microelectronics and microsystems technologies for the fabrication of µm- and sub-µm structures.
Features:
- Broadband UV, i-line, g-line
- High photosensitivity, high resolution
- Strong adhesion to critical glass/chromium surfaces for extreme stresses during wet-chemical etching processes
- For the production of CD masters and lattice structures
- AR-P 3170 also suitable for laser interference lithography
- Plasma etching resistant
- Combination of novolac and naphthoquinone diazide
- Safer Solvent PGMEA
Specifications:
SKU# | CM8105 | CM8106 | CM8107 |
Type | AR-P 3110 | AR-P 3120 | AR-P 3170 |
Film thickness/4000rpm | 1000nm |
550nm |
120nm |
Resolution | 0.5um | 0.4um | 0.5um |
Contrast | 3 | ||
Flash point | 46℃ | ||
Package size | 100mL/bottle |
Note: Store at 10-18℃. Available package size: 100mL, 250mL, 1L. CM8105 available upon request.