AR-P 3250 Thick Positive Resists for Electroplating and Microsystems Technology, 100mL/bottle

AR-P 3250 Thick Positive Resists for Electroplating and Microsystems Technology, 100mL/bottle

Photoresists are in particular used in microelectronics and microsystems technologies for the fabrication of µm- and sub-µm structures. 

Features:

• Broadband UV, i-line, g-line
• High photosensitivity, high resolution
• Profiles with high edge steepness dimension accuracy
• Plasma etch resistant, electroplating-stable
  
• For film thickness up to 20um
• Combination of novolac and naphthoquinone diazide
• Safer Solvent PGMEA

Specifications:

Note: Store at 10-18℃. Available package size: 100mL, 250mL, 1L.