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MSE PRO 2" JGS3 Fused Silica Wafer, 500 μm Thick, DSP, w/ Bevel, Primary Flat Only
SKU: WA1010
MSE PRO™ 2" JGS3 Fused Silica Wafer, 500 μm Thick, DSP, w/ Bevel, Primary Flat Only
Order 2" (50.8 mm) fused quartz wafers with best price on the market from a trusted materials supplier, MSE Supplies. Fused silica is used for both transmissive and reflective optics, especially where high laser damage threshold is required. JGS3 is used for IR & UV substrate.
- Custom made JGS fused silica wafers and substrates are available upon request. Please contact us for a quote.
- Corning Fused Silica 7980 High Purity Fused Silica (HPFS) and JGS1 Fused Silica wafers, windows and substrates are also available and can be custom made. Please contact us for a quote.
- Single Crystal Quartz Wafers and Substrates are also available. Please contact us for a quote.
Brand: MSE PRO™
Manufacturer: MSE Supplies LLC
Specifications:
| SKU# | WA1010 |
| Material | SiO2, fused silica (fused quartz) |
| Grade | JGS3 (optical grade fused silica) |
| Diameter | 50.8 ± 0.2 mm |
| Thickness | 500 ± 25 μm |
| Primary Flat | 16 ± 2 mm |
| Surface Polishing | Double Side Polished (DSP) with surface roughness Ra < 1 nm on both the top surface and bottom surface |
| Surface Finish | S/D 40/20 |
| TTV | < 10 μm |
| Edge | With Bevel, C shape CNC edge grounding |
Physical Properties of Fused Silica
| Density | 2.2 g/cm3 |
| Coefficient Of Thermal Expansion | 5.5*10-7 /°C (20 °C - 320 °C) |
| Thermochromism | Under constant temperature of 1140 degrees, keep annealing for 30 minutes without discoloration. |
Applications:
Fused silica (SiO2) wafers are made from high purity fused silica, ground and polished to optical grade on both sides. The fused silica wafers are suitable for many optical applications because of their excellent optical transmission characteristics. Fused silica also has excellent chemical resistance against a wide variety of solvents, as well as exceptional heat resistance, with high dimensional stability over a wide temperature range thanks to its ultra low thermal expansion coefficient.