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Specifications
To add a Cu Backing Plate with Indium Bonding for Sputtering Targets
Material Type |
Titanium Carbide |
Symbol |
TiC |
Melting Point (°C) |
3,140 |
Theoretical Density (g/cc) |
4.93 |
Z Ratio |
**1.00 |
Sputter |
RF |
Max Power Density (Watts/Square Inch) |
20*
|
Type of Bond |
Indium, Elastomer |
Purity |
99.5% |