MSE PRO 8 inch Sapphire Wafer C-Plane Single or Double Side Polish Al₂O₃ Single Crystal

MSE PRO™ 8 in Sapphire Wafer C-Plane Single or Double Side Polish, Prime Grade

Customized sapphire wafers and windows are available upon request

• Product SKU#: WA0436 for single side polished, WA0437 for double side polished
• Material: High purity single crystal Al₂O₃, sapphire wafer.
• Dimension: 200.00 mm +/- 0.20 mm, 8 inch
• Thickness: 1600 +/- 25 um for single side polished, 1150+/-25um for double sides polished
• Orientation: C plane (0001) off M (1-100) plane 0.2 +/- 0.1 degree
• Notch Orientation: A plane <11-20>+/- 0.5 degree (NOT Flat)
• Notch Depth: 1.05-1.25mm
  
• Total Thickness Variation (TTV): ≤15um for SSP, ≤25 um for DSP
• Bow: -20 to 10 um for SSP, -25 to 25 um for DSP
• Warp: ≤20um for SSP, ≤30 um for DSP
• Thermal Expansion Coefficient: 6.66 x 10^-6 / °C parallel to C axis, 5 x 10^-6 /°C perpendicular to C axis
• Dielectric Strength: 4.8 x 10⁵ V/cm
  
• Dielectric Constant: 11.5 (1 MHz) along C axis, 9.3 (1 MHz) perpendicular to C axis
• Dielectric Loss Tangent (a.k.a. dissipation factor): less than 1 x 10^-4
• Thermal Conductivity: 40 W/(m.K) at 20℃ 
• Polishing: single side polished (SSP) or double side polished (DSP) Ra < 2 nm. The reverse side of SSP wafer was fine ground to Ra = 0.7 - 1.0 um.
  
• Images for reference only