MSE PRO Barium Titanate Sputtering Target BaTiO3
SKU: TA0911
Barium Titanate (BaTiO3) Sputtering Target Specifications
To add a Cu Backing Plate with Indium Bonding for Sputtering Targets
Material Type | Barium Titanate |
Chemical Formula |
BaTiO3 |
Purity (%) | 99.9 |
Melting Point (°C) | 1,625 |
Theoretical Density (g/cm3) | 6.02 |
Relative Density (%) | 85 |
Z Ratio | 0.464 |
Sputter | RF |
Max Power Density (Watts/Square Inch) |
20 |
Type of Bond (please contact us for Cu backing plate and bonding service) |
Indium |