Thank you!

Your quote has been successfully submitted!

For products requiring additional information, our team will contact you within 1 business day

Failed

There was an error submitting your quote. Please try again.

MSE PRO Precision Diamond Saw, Max. Cutting Capacity 40x50mm– MSE Supplies LLC
Menu

This product has been added to the cart.

MSE PRO Precision Diamond Saw with Analog Control, Cutting Capacity Max. 40x50mm - MSE Supplies LLC

MSE PRO Precision Diamond Saw with Analog Control, Cutting Capacity Max. cutting diameter 40mm

SKU: MA1351

  • $ 5,24095
  • Save $ 62900



MSE PRO™ Precision Diamond Saw with Analog Control, Cutting Capacity Max. cutting diameter 40mm

MSE Supplies offers a precision diamond saw with analog control. This diamond saw is a precision wafering saw with variable speed, meticulously engineered for accurate material sectioning. Its innovative design guarantees micrometer precision cutting across a diverse range of materials, including metals, ceramics, crystals, glass, electronics, and other engineered materials.

Brand: MSE PRO™ 

Manufacturer: MSE Supplies LLC

Main Features:

  • An enclosed, transparent protective cover and a safety switch to ensure operator safety while allowing for easy observation.
  • The feed speed of the processed object can be precisely adjusted with the gravity loading system, reducing sample damage.
  • A closed-loop control system, prevents overload and protects the motor and circuit from potential damage due to heat.
  • The cutting machine will automatically stop upon completion of the sample cutting, enabling convenient unattended processing.
  • 7 unique sample clamps to accommodate varying sample sizes for precise cutting.
  • Utilizing sintered diamond saw blades allows for accurate cutting of a variety of tough materials, including glass, circuit boards, and rocks.
  • Optional: Large-size circuit board table cutting device (NOT included) facilitates in cutting large-size samples, such as sheet materials, circuit boards, and glass.

MSE supplies offers various diamond saws for wafer cutting with different capacities, please contact us for more information. Extra cutting fluid and diamond/CBN blades are also available upon request.

                                  Technical Specifications:

                                  SKU

                                  MA1351

                                  Cut-off Blade Size (Standard Diamond DCWA-150)

                                  150x0.5x12.7 mm (6 inch)

                                  Arbor Size

                                  12.7 mm (0.5 inch)

                                  Accuracy

                                  0.01 mm

                                  Cutting Capacity

                                  Max. cutting diameter 40mm

                                  Built-in Cooling Circulation Device

                                  The cutting blade induces water circulation within the water tank to provide cooling.

                                  Max Speed 

                                  1500 RPM

                                  Power

                                  750 W

                                  Power Voltage Supply

                                  110 V 60 Hz

                                  Outer Dimensions

                                  455x610x380 mm

                                  Weight

                                  33 kg