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2" Corning ULE (Ultra Low Expansion Glass) 7972 Wafer, 0.35mm Thickness, DSP, No Flat
2" JGS1 Ultraviolet (UV) Grade Fused Silica Wafer, 500 um, DSP, w/ Bevel, Primary Flat Only
2" JGS2 Fused Silica Wafer, 500 um Thick, DSP, w/ Bevel, Primary Flat Only
2" Vacuum Release Tray for Extremely Fragile Materials Storage (Pack of 10)
2.0-2.2 mm Ceria Stabilized Zirconia Beads Milling Media, 1 kg
2.5-2.8 mm Ceria Stabilized Zirconia Beads Milling Media, 1 kg
2.8-3.2 mm Ceria Stabilized Zirconia Beads Milling Media, 1 kg
25 kg Zirconia Toughened Alumina Sintered Beads, ZTA-W Milling Media (Invented for Wet Grinding)
25 pcs of 4680 Cylinder Cell Case with Anti-Explosive Cap
3" JGS2 Fused Silica Wafer, 500 um Thick, DSP, w/ Bevel, Primary Flat Only
3" Schott Borofloat 33 Glass Wafer, 500 um Thick, DSP, w/ Bevel, Primary Flat Only
3.2-3.5 mm Ceria Stabilized Zirconia Beads Milling Media, 1 kg
300g Battery Grade Lithium Magnesium (Mg 10 wt%) Alloy Foil 50 mm W x 100 um T for Battery Research
4 in Silicon Carbide Wafers 4H-SiC N-Type or Semi-Insulating SiC Substrates
4 inch High Purity (Undoped) Silicon Carbide Wafers Semi-Insulating SiC Substrates (HPSI)
4 inch Patterned Sapphire Substrates (PSS) for Light Emitting Diodes (LEDs)
4" Silicon/Silicon Dioxide (Si/SiO2) Dry Thermal Oxide Silicon Wafer, Prime Grade
4" Vacuum Release Tray for Extremely Fragile Materials Storage (Pack of 10)
5N (99.999%) Perovskite Grade Lead (II) Bromide (PbBr2), 5g
6 inch N-type SiC Epitaxial Wafers on SiC Substrates