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MSE PRO Monocrystalline Cubic Boron Nitride (CBN) Superabrasive Powder– MSE Supplies LLC

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MSE PRO Monocrystalline Cubic Boron Nitride (CBN) Superabrasive Powder

SKU: CS0063

To better serve you, we would like to discuss your specific requirement.
Please Contact Us for a quote.

Monocrystalline Cubic Boron Nitride (CBN) Superabrasive Powder

Cubic Boron Nitride (CBN) is second only to diamond in hardness but it has two times the thermal stability of diamond.  CBN has four times the wear resistance than that of traditional abrasives and its has extraordinary thermal conductivity. It is designed for fine grinding and polishing in a variety of demanding surface finishing applications, such as metal bond grinding wheels, resin bond grinding wheels, vitrified bond wheels and electroplated products. 

Material Cubic Boron Nitride (CBN)
Density (g/cm3) 3.48
Bulk modulus (GPa) 367
Microhardness (GPa) 75-90
Melting point (K) 3500
Expansion coefficient (10−6/K) 4.7
Thermal conductivity (kW/m·K) 1.3
Thermal stability (K) 1573~1673


In order to choose the optimum monocrystalline CBN super-abrasive powder for your application, please consider the following the following properties:

MSE Supplies offers a variety of monocrystalline CBN super-abrasive powders with different colors and grain size. The listed below is the powders that we can offer. Please contact us for your specific need.

Color Strength Feature Application Grain Size (mesh)
Black Medium

High thermal stability

Protruding acute angle

High performance and grinding efficiency

Used in resin and vitrified bond system

60-80

80-100

100-120

120-140

140-170

170-200

200-230

230-270

270-325

325-400

Black Medium

Texture structure surface

Good self-sharpness

Good surface finish of machined workpiece

Used in resin and vitrified bond system

60-80

80-100

100-120

120-140

140-170

170-200

200-230

230-270

270-325

325-400

Black Medium

High thermal stability

Balanced crushing strength and feature

Balanced grinding efficiency and life

Used in vitrified bond system 60-80

80-100

100-120

120-140

140-170

170-200

200-230

230-270

270-325

325-400
Dark brown High

Sharp acute angle

High thermal stability

Used in vitrified, metal and resin bond system with high strength requirement

60-80

80-100

100-120

120-140

140-170

170-200

200-230

230-270

270-325

325-400

Golden High

High thermal stability

Used in the electroplating tool, metal and vitrified bond system

40-50

50-60

60-80

80-100

100-120

120-140

140-170

170-200

200-230

230-270

270-325

325-400

Amber Medium

Good self-sharpness

Used in resin bond system

60-80

80-100

100-120

120-140

140-170

170-200

200-230

230-270

270-325

325-400

Reference

1. Recent progress of boron nitrides, Ultra-Wide Bandgap Semiconductor Materials, Materials Today, 2019, Pages 347-419

2. Ultrahard nanotwinned cubic boron nitride. Nature 493, 385–388 (2013)

3. Epitaxy of cubic boron nitride on (001)-oriented diamond. Nature Mater 2312–315 (2003)