Thank you!

Your quote has been successfully submitted!

For products requiring additional information, our team will contact you within 1 business day

Failed

There was an error submitting your quote. Please try again.

MSE PRO Aluminum Nitride (AlN) Ceramic Substrate (120mm x 120mm)– MSE Supplies LLC

Free Shipping on MSE PRO Online Orders of $500 or More! U.S. Orders Only * Offer Excludes Hazmat Shipments *

Menu
Cart

This product has been added to the cart.

Aluminum Nitride (AlN) Ceramic Substrate (120mm x 120mm) - MSE Supplies LLC

MSE PRO Aluminum Nitride (AlN) Ceramic Substrate (120mm x 120mm)

SKU: WA2004

  • £12400
  • Save £1400

MSE PRO™ Aluminum Nitride (AlN) Ceramic Substrate (120mm x 120mm)

MSE Supplies offers high quality AlN ceramic plates made in Japan. Aluminum Nitride (AlN) Ceramic Substrate is made of high purity AlN ceramics. AlN is a white ceramic material with excellent comprehensive properties. These properties include excellent thermal conductivity (>170W/mK), electrical insulation and heat radiation, which make it suitable for electrical applications. AlN is also widely used in semiconductor industry for the replacement of Beryllium Oxide (BeO) due to that AlN isn't hazardous under machining. Other properties also include resistance to thermal shock, low dielectric constant and dielectric loss, and a coefficient of thermal expansion compatible with silicon which make AlN substrate an ideal material for semiconductor industry and electronic device packaging.

Brand: MSE PRO™ 

Manufacturer: MSE Supplies LLC

Please contact us for customization or bulk order.

Specifications:

SKU# WA2004
Dimension (LxW) 120 mm x 120 mm
Thickness 0.254 mm
Thermal Conductivity 170 W/m.K
Dielectric Constant 8.8 (MHz)
Bulk Density 3.32 g/cm³
Surface Roughness Ra < 0.6 μm on both sides

References:

1. Aluminum nitride-an alternative ceramic substrate for high power applications in microcircuits. IEEE transactions on components, hybrids, and manufacturing technology 7, no. 4 (1984): 399-404. 

2. Ceramic substrates for high voltage power electronics: past, present and future. In 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP), pp. 91-96. IEEE, 2019.