AR-P 3100 Series Adhesion-enhanced Positive Resists for the Production of Masks and Fine Scale Divisions, 100mL/bottle

AR-P 3100 Series Adhesion-enhanced Positive Resists for the Production of Masks and Fine Scale Divisions, 100mL/bottle

Photoresists are in particular used in microelectronics and microsystems technologies for the fabrication of µm- and sub-µm structures. 

Features:

• Broadband UV, i-line, g-line
• High photosensitivity, high resolution
• Strong adhesion to critical glass/chromium surfaces for extreme stresses during wet-chemical etching processes
• For the production of CD masters and lattice structures
• AR-P 3170 also suitable for laser interference lithography
• Plasma etching resistant
• Combination of novolac and naphthoquinone diazide
• Safer Solvent PGMEA

Specifications:

Note: Store at 10-18℃. Available package size: 100mL, 250mL, 1L. CM8105 available upon request.