Silicon Wafers with 100 nm Gold (12 wafers)

Silicon Wafers with 100 nm Gold (12 wafers)

Overview

Substrate: Prime Grade Silicon Wafer (100-mm dia., 525-µm thick)

Metal Layer: Gold, 100-nm

Gold Purity: 99.999%

Adhesion Layer: Titanium, 5-nm

Quantity: Twelve (12) gold-coated silicon wafers

Description

Silicon wafers coated with high purity gold (99.999%) exhibit high electrical conductivity and high reflectivity. Our gold coated wafers feature a thin titanium adhesion layer to ensure proper adhesion of the gold layer to the silicon substrate.

This product can be used as a substrate for analytical characterization of thin films, nanoparticles, proteins and self-assembled monolayers via electrochemistry, IR spectroscopy, Raman spectroscopy, X-ray spectroscopy, or ellipsometry. Gold-coated wafers are also ideal substrates for fabrication of complex electrochemical devices.

Gold-coated silicon wafers, and gold-coated silicon chips, are used extensively as substrates for analytical characterization of materials.  For example, materials deposited onto gold-coated wafers can be analized via ellipsometry, Raman spectroscopy or infrared (IR) spectroscopy due to the high-reflectivity and favorable optical properties of gold.  In addition, gold-coated silicon wafers are excellent substrates for fabricating electrodes, electrochemical sensors, self-assembled monolayers, photonic devices, and other advanced technologies.